The Polymer Society of Korea

Abstract

Complex ceramic modules are increasingly required for next-generation aerospace systems and high-power electronic devices, yet their fabrication is still limited by energy-intensive sintering and poor scalability. Here, we report a cold, rapid, and scalable stamping process that enables the sintering-free fabrication of complex ceramic modules. This process is based on highly viscoelastic hexagonal boron nitride (h-BN) doughs engineered through a percolated para-aramid fiber network and densified using a bimodal alumina system. Despite an ultralow binder content of 5.1 wt%, the doughs undergo large plastic deformation during stamping and rapidly recover solid-like stability upon stress relaxation. As a result, intricate three-dimensional ceramic architectures exceeding 10 cm can be fabricated within 2 s under ambient conditions. The resulting fiber-reinforced structures exhibit excellent structural integrity and fatigue resistance over a wide temperature range.