[1PS-247]
우수논문발표상 응모자Electroless Ni plating adhesion enhancement on recycled PC/ABS through BA-g-MAA–coagulant control of Polybutadiene Latex particle size
발표자박민서 (인하대학교 대학원 화학,화학공학 융합학과)
연구책임자심상은 (인하대학교)
Abstract
This study enhances electroless Ni plating adhesion on recycled PC/ABS by controlling ABS rubber morphology while keeping the alloy ratio unchanged. A BA-g-MAA coagulant is synthesized and applied to a commercial polybutadiene latex to produce two particle-size groups (~300 nm and ~1000 nm), which are compounded with rPC/ABS and injection-molded under identical conditions. During etching, polybutadiene domains are selectively dissolved to form pits that drive adhesion: smaller particles are expected to create a high density of uniform pits, whereas larger particles generate deeper, wider pits that improve mechanical interlocking. Particle size and rubber-domain morphology are verified by PSA and SEM, and plating uniformity is assessed by OM, providing a reproducible and scalable guideline compatible with existing plating lines.