The Polymer Society of Korea

Abstract

The advancement of ultra-high-speed communication technologies demands the development of insulating materials with low dielectric properties (low-D_k, low-D_f) for miniaturization and high-density integration of electronic devices. Aromatic polyimides (PIs), known for their excellent thermal and mechanical stability, and intrinsic insulating properties, are promising for aerospace and microelectronic applications. However, the polar imide rings in PIs lead to high dielectric properties. Herein, novel PI systems were designed by incorporating rigid ester-based mesogenic units and bulky moieties into the polymer backbone. Ester-containing mesogenic structures enhance torsional rigidity and promote molecular orientation. In addition, the introduction of bulky structures increases the interchain free volume. These strategies result in the development of PI-based materials exhibiting low dielectric properties, making them attractive for high-frequency microelectronic applications.