The Polymer Society of Korea

Abstract

Thermally conductive adhesives (TCAs) for advanced electronics are increasingly required to dissipate higher heat fluxes while conforming to rough, warped, pressure-limited interfaces. In practice, ceramic loading in electrically insulating TCAs increases stiffness and reduces processability, hindering conformal wetting and defect-free bonding and limiting gains in interfacial heat transfer. In this work, we report an electrically insulating TCA formulation designed to enhance interfacial heat transfer while maintaining strong adhesion and durable bonding. The strategy combines hybrid ceramic packing to create insulating heat pathways, junction and interface engineering to reduce bottleneck resistance, and a compliant phase that stabilizes intimate contact. The resulting adhesive delivers an improved balance of thermal performance, adhesion, electrical insulation, and bonding durability, pointing to a scalable route for next-generation thermal interfaces in electronics.