The Polymer Society of Korea

Abstract

Continued miniaturization of semiconductor systems requires assembling heterogeneous thin films into three-dimensional architectures, yet conventional fabrication remains incompatible with emerging materials such as two-dimensional crystals and soft polymers. Although monolithic stacking of 2D heterostructures offers a viable integration route, its implementation is limited by the lack of a universal transfer platform. Here, we introduce structured liquids such as hydrogels as general-purpose carriers for precise and contamination-free thin-film transfer. This hydrogel-based transfer strategy decouples material growth from device assembly, ensures clean interfaces and controlled strain, and enables transparent, layer-by-layer laser patterning for deterministic stacking without alignment. By integrating polymers, 2D semiconductors, metals, and oxides, we establish a scalable framework for hybrid van der Waals device fabrication.