The Polymer Society of Korea

Abstract

Advanced low-dielectric materials with efficient heat dissipation are essential for high-frequency electronic systems. Low-dielectric polymers are developed by integrating fused aromatic units with silane and siloxane groups to form a polymer network crosslinked by octavinylsilsesquioxane. The ultralow dielectric properties originate from the low polarizability and reduced dipole density of silane and siloxane moieties, suppressing dipole polarization under high-frequency electric fields. Consequently, the polymers exhibit an ultralow dielectric permittivity (D_k = 1.79), low dielectric loss (D_f = 0.004) over 1-10 GHz, and a high thermal conductivity of 0.89 W m⁻¹ K⁻¹. Microstrip printed circuit board measurements confirm efficient signal transmission, while thermal reprocessing and solvent-based recovery demonstrate recyclability. This work was supported by the BK Four Program and the Basic Research Laboratory Program (RS-2023-00207836).