[1PS-271]
우수논문발표상 응모자Polyimide Nanocomposites with Hollow Glass Microsphere/Hexagonal Boron Nitride Hybrid Fillers for Flexible Printed Circuit Boards
발표자채승훈 (충남대학교 유기응용재료공학과)
연구책임자정영규 (충남대학교 유기응용재료공학과)
Abstract
Polyimide (PI) nanocomposite films with core-shell hybrid fillers were developed for flexible printed circuit board substrates requiring low dielectric permittivity and high thermal conductivity. Hollow glass microspheres (HGM) were used as porous low-dielectric cores, while hexagonal boron nitride (BN) served as thermally conductive shells. HGM and BN were surface-modified and chemically coupled via an amine-epoxy ring-opening reaction to form core-shell hybrid fillers, which were incorporated into a PI matrix synthesized from 4,4′-oxydiphthalic anhydride and 4,4′-oxydianiline. The dispersion, interfacial structure, and thermal, dielectric, and mechanical properties of the nanocomposites were characterized by SEM, EDS, FT-IR, XPS, TGA, DSC, LFA, LCR measurements, and tensile testing. The nanocomposites showed reduced dielectric constants and enhanced thermal conductivity while maintaining electrical insulation, indicating the effectiveness of the hybrid filler design.