The Polymer Society of Korea

Abstract

Aramid fibers (AF) possess excellent mechanical strength and thermal stability; however, their smooth and chemically inert surfaces limit interfacial adhesion with polymer matrices. In this study, AF were converted into aramid nanofibers (ANF) through a controlled deprotonation process, enabling systematic tuning of nanofiber size and surface amine functionality by varying fibrillation time. Epoxy/ANF composites were subsequently fabricated using a curing system without external hardeners, with optional silane-based surface modification to further enhance interfacial reactivity. The resulting composites exhibit properties suitable for encapsulation materials and organic interposers in advanced electronic packaging, where toughness, thermal stability, low dielectric constant, and low coefficient of thermal expansion are required. These results demonstrate that epoxy/ANF composites are promising candidates for next-generation flexible and reliable insulation materials.