The Polymer Society of Korea

Abstract

Efficient thermal management in electronic devices requires high-performance thermal interface materials (TIMs). However, conventional polymer-based TIM often suffer from low thermal conductivity, poor structural integrity, and limited recyclability. Here, we present a composite TIMs that integrates a covalent adaptable networks (CANs) with phase-change materials (PCMs) and hexagonal boron nitride (h-BN) fillers. The composite is fabricated using a Pickering emulsion strategy, where h-BN selectively assembles at PCMs droplet interfaces, followed by crosslinking of the continuous CANs matrix. This creates a continuous h-BN thermal network, while the dynamic CANs matrix ensures mechanical stability and reprocessability. The resulting TIMs shows improved thermal conductivity, latent heat buffering, and recyclability, providing a sustainable solution for next-generation electronic devices.