The Polymer Society of Korea

Abstract

Modern electronics' miniaturization triggers critical heat accumulation challenges. To ensure device stability, enhancing heat dissipation via thermally conductive nanocomposites is essential. However, achieving high thermal conductivity (TC) requires sophisticated structural engineering beyond simple filler dispersion. This presentation focuses on three-dimensional (3D) structural designs to optimize heat transport. 3D architectures—such as interconnected networks and segregated structures—establish continuous phonon pathways, significantly bypassing the high thermal resistance of polymer matrices. We discuss strategies to tailor these interfaces, including surface modification and hybrid network design. Furthermore, various fabrication methods for high-TC nanocomposites are summarized, analyzing their advantages and limitations. These perspectives provide a roadmap for developing advanced 3D-structured composites as key materials for next-generation flexible electronics.