The Polymer Society of Korea

Abstract

As electronics evolve toward higher integration density, power consumption, and mechanical deformability, advanced thermal management materials capable of anisotropic heat dissipation under deformation are increasingly required. Here, we report structurally engineered polymer-based thermal management materials incorporating boron nitride (BN) fillers to achieve efficient and deformation-tolerant heat dissipation. A bi-directionally thermally conductive composite is first developed via micro-molding of BN microscale platelets dispersed in a polymer matrix. Micro-pattern-induced bifurcation of platelet orientation enables enhanced heat transport in both through-plane and in-plane directions.  In addition, a continuous array of BN nanosheets assembled on tetrahedral microstructures is introduced to create three-dimensional thermal pathways for anisotropic heat dissipation.