The Polymer Society of Korea

김기수 (한양대학교)

엄영호 (한양대학교)

High-performance polyimide (PI) materials are widely used in aerospace and electronic applications due to their excellent thermal stability in extreme environments. However, their mechanical performance is often limited by weak interfacial bonding between heterogeneous components. To address this issue, self-reinforced PI powder composites using same-family PI fibers were investigated. Fully polymerized PI powder is non-meltable and exhibits limited molecular mobility, resulting in weak interparticle bonding after solid-state consolidation. In this study, chopped or staple PI fibers were incorporated to enhance stress transfer and mechanical integrity. The mechanical and thermal properties of the sintered composites were evaluated in relation to interparticle bonding. The results demonstrate that same-family PI fiber reinforcement improves stiffness and thermal stability without interfacial incompatibility, providing guidance for high-temperature structural polymer composites.