The Polymer Society of Korea

박경준 (경북대학교)

정인우 (경북대학교)

Epoxy-based sealants are widely used in electronics and semiconductor packaging due to their strong adhesion and thermal stability. However, maintaining mechanical reliability, electrical insulation, and low outgassing under high-temperature conditions remains challenging. In this study, an epoxy sealant system was developed by optimizing epoxy resin, curing agent, and accelerator compositions with surface-modified inorganic fillers. Silane-treated silica and alumina fillers improved dispersion and interfacial adhesion, resulting in enhanced mechanical integrity, reduced thermal expansion, and suppressed volatile release after curing. Thermal, mechanical, electrical, and outgassing-related properties were evaluated, confirming improved performance and reliability for electronic packaging applications. This work was supported by Korea Institute for Advancement of Technology (KIAT) grant funded by the Korea Government (MOTIE) (RS-2024-00419967, HRD Program for Industrial Innovation).