Interlayer-Engineered Al–Cr Laminated Metal Films for Enhanced Flexibility in Flexible Electronics
발표자
유하솜 (가천대학교)
연구책임자
이한솔 (가천대학교)
공동저자
유하솜 (가천대학교), 배주영 (가천대학교), 이한솔 (가천대학교)
초록
내용
Metal thin film electrodes are key components in flexible electronics, but their mechanical reliability under bending remains limited. Laminated metal structures composed of multiple thin layers improve strain tolerance, yet further enhancement is required. Here, we report an interlayer engineering strategy to improve the flexibility of laminated metal films. Aluminum was used as the primary conductor, and ultrathin chromium interlayers were inserted between adjacent Al layers. The Cr interlayers reduced the Al grain size and enhanced interfacial adhesion between Al layers, leading to improved mechanical integrity under bending. As a result, Al-Cr laminated films exhibited significantly suppressed resistance increases compared to films without interlayers. These results demonstrate that interlayer engineering is an effective approach for mechanically robust metal electrodes in flexible electronics.