Thermo-Mechanical and Dielectric Performance of TLCP/EGMA Blend Films for Flexible Electronics
발표자
김민철 (충남대학교 유기응용재료공학과)
연구책임자
정영규 (충남대학교 유기응용재료공학과)
공동저자
김민철 (충남대학교 유기응용재료공학과), 정영규 (충남대학교 유기응용재료공학과)
초록
내용
Low-dielectric polymer substrates with high mechanical durability are required for high frequency communication devices subjected to repeated bending and folding. In this study, flexible thermotropic liquid crystalline polymer (TLCP) films were fabricated by melt blending TLCP with an ethylene-glycidyl methacrylate (EGMA) copolymer, followed by hot pressing. The effects of EGMA incorporation on blend morphology, melt viscoelasticity, and thermo-mechanical properties were investigated to enhance film flexibility while analyzed by scanning electron microscopy, thermogravimetric analysis, and differential scanning calorimetry, while rheological and dynamic mechanical properties were evaluated using rotational rheometer and dynamic mechanical analysis. Dielectric permittivity measurements confirmed the suitability of the film for high-frequency substrate applications. The results show that EGMA blending improves TLCP foldability without significantly compromising low-dielectric performance.