Electroless Ni plating adhesion enhancement on recycled PC/ABS through BA-g-MAA–coagulant control of Polybutadiene Latex particle size
발표자
박민서 (인하대학교 대학원 화학,화학공학 융합학과)
연구책임자
심상은 (인하대학교)
공동저자
박민서 (인하대학교 대학원 화학,화학공학 융합학과), 심상은 (인하대학교)
초록
내용
This study enhances electroless Ni plating adhesion on recycled PC/ABS by controlling ABS rubber morphology while keeping the alloy ratio unchanged. A BA-g-MAA coagulant is synthesized and applied to a commercial polybutadiene latex to produce two particle-size groups (~300 nm and ~1000 nm), which are compounded with rPC/ABS and injection-molded under identical conditions. During etching, polybutadiene domains are selectively dissolved to form pits that drive adhesion: smaller particles are expected to create a high density of uniform pits, whereas larger particles generate deeper, wider pits that improve mechanical interlocking. Particle size and rubber-domain morphology are verified by PSA and SEM, and plating uniformity is assessed by OM, providing a reproducible and scalable guideline compatible with existing plating lines.