Synthesis and Characterization of High-Thermal-Stability Amide-Containing Polyimide
발표자
강경윤 (영남대학교)
연구책임자
이승우 (영남대학교)
공동저자
강경윤 (영남대학교), 이승우 (영남대학교), 박수빈 (영남대학교)
초록
내용
As the demand for lightweight and miniaturized products increases, polymer materials with high thermal resistance are widely used in various industrial applications. In this study, amide functional groups capable of forming intermolecular hydrogen bonding were introduced into polyimide structures to enhance thermal stability and promote molecular orientation and dense chain packing. Diamines containing four different types of amide functional groups were synthesized and reacted with four kinds of dianhydrides to prepare poly(amic acid) (PAA), followed by thermal imidization to obtain polyimide films. The chemical structures of the polymers were characterized by FT-NMR and FT-IR spectroscopy to confirm successful incorporation of amide functionalities. The thermal properties of polyimide films were analyzed through TGA, DSC, and TMA, and the mechanical properties were analyzed by UTM.