Hydrogen-Bonded Binary Bismaleimide Systems for High-Temperature Adhesives
발표자
윤정화 (경북대학교)
연구책임자
남기호 (경북대학교)
공동저자
윤정화 (경북대학교), 남기호 (경북대학교)
초록
내용
High-temperature structural adhesives are essential for lightweight structures in aerospace, automotive, and electronics applications. Commercial epoxy- and urethane-based adhesives provide strong adhesion but degrade under high-temperature conditions. To address this limitation, this study explores bismaleimide (BMI), an addition-type polyimide, as a high-temperature structural adhesive. BMI exhibits low moisture uptake, low volatile emission, and good processability. Two BMI monomers with complementary functional groups were designed to introduce hydrogen bonding into the BMI network. The incorporation of hydrogen bonding enables controlled interfacial interactions, reduced curing temperature, and enhanced toughness and adhesive strength. This molecular design strategy highlights the potential of hydrogen-bonded BMI systems as promising next-generation structural adhesives for reliable performance in high-temperature environments.