A high-performance silicone glue etchant with a defined certificate-of-analysis (CoA) parameter is proposed designed as a silicone glue etchant for temporary debonding process in wafer-level packaging. Current, tetrabutylammonium fluoride (TBAF)-based etchants suffer from slow etching kinetics and severe moisture sensitivity. To overcome these limitations, a linear alkane swelling solvent (LASS) was introduced via Hildebrand solubility-parameter matching to promote efficient swelling of the silicone glue. An optimized formulation combining TBAF in N-octyl-2-pyrrolidone with LASS achieved a 12-fold improvement in etching rate over the in-use etchant, while maintaining stable performance up to 2.0 wt% moisture. These results demonstrate that LASS addition have effectively enhanced the performance and reliability of silicone glue etchant.
- 본 연구는 2026년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임 (RS-2022-NR070869)