Herein, silica-covered epoxy bead (SCEB) materials are prepared to enable continuous heat pathways in epoxy molding compound (EMC) for advanced packaging applications. The SCEB materials are fabricated via a syringe-assisted droplet curing process, in which a mixture of silica, epoxy resin, and curing agent is dropped into a poly(vinyl pyrrolidone) aqueous solution under stirring, allowing continuous formation of spherical epoxy beads. Owing to interfacial property differences, silica particles are immobilized on the bead surface. The SCEB materials are incorporated into EMC to attain SCEB-EMC and compared to pristine EMC containing the same amount of silica. Under infrared thermography, SCEB-EMC exhibits superior heat dissipation performance compared with pristine EMC, which is attributed to the formation of continuous heat pathways induced by the silica-covered epoxy bead structure.
- 본 연구성과물은 2026년도 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업임 (RS-2025-25437296)