제출 정보
조두호 (한국화학연구원)
정성묵 (한국화학연구원)
초록
Due to recent innovations in electronic device form factors and smart healthcare, research on stretchable printed circuit boards(sPCB) has been actively conducted, moving beyond traditional rigid PCB. While it would be ideal for the substrate, electrodes, and components to all be stretchable, creating flexible components remains challenging. Therefore, this study reports on materials for developing a partially stretchable PCB where only the areas without components are stretchable.
First, we fabricated a partially stretchable substrate by creating rigid islands only in areas where components are mounted. To enhance the performance of stretchable conductive composite, we formed internal porous structures using a hydrophilic solution process. Furthermore, We developed a composite achieving high conductivity and strain stability at low filler loadings through secondary fluid-induced aggregation along conductive pathways. 3D nozzle-jet printing and multi-layering enabled high integration.
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