Polyimide Nanocomposites with Hollow Glass Microsphere/Hexagonal Boron Nitride Hybrid Fillers for Flexible Printed Circuit Boards
발표자
채승훈 (충남대학교 유기응용재료공학과)
연구책임자
정영규 (충남대학교 유기응용재료공학과)
공동저자
채승훈 (충남대학교 유기응용재료공학과), 정영규 (충남대학교 유기응용재료공학과)
초록
내용
Polyimide (PI) nanocomposite films with core-shell hybrid fillers were developed for flexible printed circuit board substrates requiring low dielectric permittivity and high thermal conductivity. Hollow glass microspheres (HGM) were used as porous low-dielectric cores, while hexagonal boron nitride (BN) served as thermally conductive shells. HGM and BN were surface-modified and chemically coupled via an amine-epoxy ring-opening reaction to form core-shell hybrid fillers, which were incorporated into a PI matrix synthesized from 4,4′-oxydiphthalic anhydride and 4,4′-oxydianiline. The dispersion, interfacial structure, and thermal, dielectric, and mechanical properties of the nanocomposites were characterized by SEM, EDS, FT-IR, XPS, TGA, DSC, LFA, LCR measurements, and tensile testing. The nanocomposites showed reduced dielectric constants and enhanced thermal conductivity while maintaining electrical insulation, indicating the effectiveness of the hybrid filler design.