Enhanced Thermal Conductivity and Copper Adhesion of Thermotropic Polyarylate Composites via Hybrid Filler Incorporation and Interface Engineering
발표자
최형호 (충남대학교 유기응용재료공학과)
연구책임자
정영규 (충남대학교 유기응용재료공학과)
공동저자
최형호 (충남대학교 유기응용재료공학과), 정영규 (충남대학교 유기응용재료공학과)
초록
내용
Thermotropic polyarylate (TP) is a promising substrate material for due to its low dielectric constant, high mechanical strength, and excellent thermal and high-frequency stability. However, its intrinsically low thermal conductivity and poor adhesion to copper during copper clad laminate (CCL) fabrication limit practical applications. Herein, hexagonal boron nitride (hBN) was incorporated into TP via an eco-friendly ball-milling process, enabling in situ exfoliation of hBN and uniform coating on the TP surface. To further enhance thermal pathways, alumina and aluminum nitride (AlN) were introduced via facile masterbatch melt compounding. These TP composites were applied to CCL fabrication, with emphasis on improving interfacial adhesion between the composite substrate and copper foil. This strategy enables simultaneous enhancement of thermal conductivity and interfacial bonding without the use of additional adhesive layers, offering a viable route with reduced signal loss.