Surface-Functionalized BNNSs for Tailoring Heat Transfer and Dielectric Behavior in Epoxy Composites
발표자
노유진 (충남대학교 유기응용재료공학과)
연구책임자
정영규 (충남대학교 유기응용재료공학과)
공동저자
노유진 (충남대학교 유기응용재료공학과), 정영규 (충남대학교 유기응용재료공학과)
초록
내용
Hexagonal boron nitride nanosheets (BNNSs) are promising thermally conductive and electrically insulating fillers for epoxy-based semiconductor packaging. This study functionalized BNNSs with amine (A-BNNS) or epoxy (E-BNNS) groups to investigate the role of interfacial chemistry on composite performance. A-BNNS and E-BNNS were incorporated into epoxy matrices for systematic comparison. Different surface groups altered interfacial adhesion and filler-matrix interactions, resulting in distinct heat transfer and dielectric behaviors. Comparative analysis reveals how functionalization governs thermal conductivity and electrical insulation. These results provide guidelines for designing high-performance, electrically insulating, and thermally conductive epoxy composites for semiconductor packaging applications.