Improved Thermal Insulation Properties of Polysilsesquioxane by Introducing Intramolecular Voids
발표자
이예지 (한국교통대학교)
연구책임자
김경민 (한국교통대학교)
공동저자
이예지 (한국교통대학교), 임정혁 (한국교통대학교), 김경민 (한국교통대학교)
초록
내용
Introducing intramolecular void spaces is an effective strategy to enhance thermal insulation performance. Polysilsesquioxane is a promising insulation material due to its organic-inorganic hybrid structure. In this study, oligomethylsilsesquioxane (MSQ-OH) was synthesized via a sol-gel reaction of triethoxymethylsilane. To investigate the effect of void spaces on thermal insulation, bridged-polysilsesquioxane (BPS) films were prepared by reacting MSQ-OH with two different crosslinkers, neopentyl glycol diglycidyl ether (NPGDGE) and poly(propylene glycol) diglycidyl ether (PPGDGE). These crosslinkers were selected for their varying chain lengths to control the resulting void structures. The chemical structures and thermal properties of the synthesized materials were characterized using various analytical techniques, and the thermal insulation performance was evaluated based on the thermal diffusivity of the prepared films.