Pickering Emulsion-Driven Design of Thermal Interface Materials with Segregated Filler Networks
발표자
이민준 (부산대학교)
연구책임자
김채빈 (부산대학교)
공동저자
이민준 (부산대학교), 김채빈 (부산대학교)
초록
내용
Efficient thermal management in electronic devices requires high-performance thermal interface materials (TIMs). However, conventional polymer-based TIM often suffer from low thermal conductivity, poor structural integrity, and limited recyclability. Here, we present a composite TIMs that integrates a covalent adaptable networks (CANs) with phase-change materials (PCMs) and hexagonal boron nitride (h-BN) fillers. The composite is fabricated using a Pickering emulsion strategy, where h-BN selectively assembles at PCMs droplet interfaces, followed by crosslinking of the continuous CANs matrix. This creates a continuous h-BN thermal network, while the dynamic CANs matrix ensures mechanical stability and reprocessability. The resulting TIMs shows improved thermal conductivity, latent heat buffering, and recyclability, providing a sustainable solution for next-generation electronic devices.