Reprocessable, High-Temperature, Creep-Resistant Structural Adhesives Based on Disulfide-Linked Epoxy Covalent Adaptable Networks
발표자
박재홍 (부산대학교)
연구책임자
김채빈 (부산대학교)
공동저자
박재홍 (부산대학교), 김채빈 (부산대학교)
초록
내용
As technical demands increase in industries such as automotive and construction, engineers face the challenge of enhancing material performance while reducing costs. Structural adhesives have attracted attention due to their ease of application, lightweight design, and high mechanical performance; however, most conventional systems show severe creep or failure at elevated temperatures and lack reprocessability. To address these limitations, this study presents a structural adhesive based on a covalent adaptable network (CAN) enabled by disulfide bond exchange. The adhesive is composed of an aromatic epoxy resin and an amine-based crosslinker, cured via an epoxy–amine reaction to form a dynamic network capable of reversible bond exchange. As a result, it exhibits strong adhesion to metal substrates and remains reprocessable. Moreover, its high glass transition temperature (Tg) ensures reliable adhesion at elevated temperatures, enabling both durable use and on-demand reprocessing.