The Polymer Society of Korea

박민아 (인하대학교 )

심상은 (인하대학교)

Effective thermal management is critical for electronic packaging reliability, yet epoxy composites typically require high loadings of silica fillers with intrinsically low thermal conductivity. In addition, conventional 0D fillers suffer from severe phonon scattering at point contacts, limiting heat transport.

To overcome these limitations, we developed a 0D/1D hybrid filler system composed of silica particles (SP) and silica nanowires (SNW). The SNWs were synthesized via anisotropic hydrolysis and condensation of TEOS within TEOS-rich droplets formed by liquid–liquid phase separation. Both fillers were uniformly coated with a high-thermal-conductivity Al₂O₃ shell through pH-controlled electrostatic adsorption, yielding SP@Al₂O₃ and SNW@Al₂O₃. Cross-sectional SEM revealed that the nanowires effectively bridge particles to form continuous thermal conduction pathways, demonstrating the potential of this hybrid filler for next-generation thermally conductive composites.