Under a slim and miniaturized trend of assembled electronic devices, greater integration and higher performance of application processors (APs) lead to increased power consumption, resulting in unnecessary heat generation. By the way, to extract heat from the AP, most studies have predominantly concentrated on directly setting a simple two-dimensional thermal interface material (TIM) on top of the AP to connect it with an upper heat sink or a vapor chamber, focusing on the vertical heat dissipation. In this study, we presented a novel TIM with three-dimensional, shape-conforming soft structure fitted to the geometry of PBA-mounted components by using PCM (Phase Change Material). Utilizing precision molding techniques and composite design strategies, we aimed to improve the thermal interfacial contact between the PCM and electronic components followed by enhanced hedat dissipation efficiency