[2PS-278]
Development and Characterization of Low-Temperature Fast-Curing Polymer Curing Agents
발표자정영훈 (성균관대학교)
연구책임자구종민 (성균관대학교)
Abstract
With the increasing demand for low-temperature processing in electronic devices, the development of polymer curing agents capable of rapid curing at low temperatures has become essential. In this study, we synthesized a novel low-temperature fast-curing agent by utilizing polymer phase transitions and dynamic disulfide (-S–S–) bonds to overcome the limitation of conventional Diels–Alder-based agents, which require curing temperatures above 140 °C. The curing agent was prepared in microparticle form via an oil-in-water emulsion method, and differential scanning calorimetry (DSC) confirmed curing initiation at 100–130 °C. Furthermore, the introduction of thiol and imidazole functionalities enhanced reactivity. This work demonstrates the potential of a new class of polymer curing agents applicable to low-temperature bonding processes.