[2PS-196]
Thermal Performance Limits of Polyimide for Aerospace-Grade Property Design
발표자이현준 (한양대학교)
연구책임자엄영호 (한양대학교)
Abstract
Polyimide (PI) films are known for excellent thermal stability, making them suitable for aerospace use under extreme temperatures. In such applications, long-term thermal and mechanical stability is essential. This study investigates high-temperature degradation of PI films to define their thermal performance limits for aerospace-grade applications. Heat treatment was performed above 300 °C, and changes in structure and properties were analyzed using FT-IR and SEM. Results showed notable mechanical strength loss as degradation progressed. Based on these findings, a safe operational temperature range was proposed to ensure material stability. These results can help evaluate the reliability of PI-based aerospace materials.