The Polymer Society of Korea

Abstract

As semiconductor devices continue to shrink, the limits of miniaturization are being reached, increasing demand for highly integrated systems. IC packaging, which protects and connects chips after front-end processing, has evolved from basic interconnects to advanced technologies that enhance functionality and competitiveness. In stacked semiconductor structures, epoxy-based non-conductive films (NCFs) are commonly used for chip bonding. However, higher stacking levels generate excessive heat, requiring materials with excellent thermal dissipation. In addition, the high thermal expansion of polymers induces interfacial stress, causing warpage. Other key concerns include controlling adhesion, viscosity, and optical transmittance. To address these issues, our team is developing NCFs with improved thermal conductivity and reduced expansion by optimizing filler shape, using hybrid fillers, and constructing thermally conductive networks within the polymer matrix.