[3PS-173]
Directed Assembly of Metal Fillers for Anisotropic Heat Transfer in Thermal Interface Materials through Dielectrophoresis
발표자박예일 (서울과학기술대학교)
연구책임자구형준 (서울과학기술대학교)
Abstract
The growing demand for thermal interface material (TIM) composites with improved elasticity and thermal conductivity has been driven by the need for cost-effective thermal management solutions in next-generation flexible electronic devices, which inherently pose significant heat dissipation challenges. In this study, we employed dielectrophoresis (DEP) to induce anisometric alignment of metallic filler particles within a polymer matrix. This alignment strategy led to a marked enhancement in anisotropic thermal conductivity, reaching up to 0.6 W/m·K at a filler volume fraction of φ = 20%. In addition, mechanical testing revealed that the resulting TIM composites exhibited excellent elasticity and flexibility, making them well-suited for use in flexible and deformable electronic systems.