The Polymer Society of Korea

Abstract

Overheating is a key cause of failure in electronic systems. To overcome this problem, current studies are being conducted on polymer matrices that are economical, reduced weight, low dielectric constants, and excellent thermal conductivity. While processable polymers are easy for manufacturing, their thermal conductivity remains low (0.1-0.5 Wm^-1K^-1), indicating restricted applicability in thermal management uses. This study investigated the thermal response of epoxy/hexagonal boron nitride systems before and after introducing biphenyl amines. To enhance thermal conductivity and facilitate phonon movement, this study aimed to increase the crystallinity of the polymer matrix. Introducing biphenyl structures into the polymer matrix resulted in a thermal conductivity enhancement of about 1.8 times, according to the experimental results. The outcomes of this study are projected to advance the heat management performance of electronics, thus improving their stable operation and long-term reliability.