The Polymer Society of Korea

Abstract

Polyimide foam (PIF) has excellent mechanical flexibility, thermal/chemical stability, radiation resistance, and flame retardancy providing essential properties for advanced applications in extreme or multifunctional environments, including wearable electronics, aerospace cushioning, soft robotics, and thermally resilient impact-absorbing systems. In this study, functional PIFs were developed using poly(ether amide acid salt) (PEAS) powder as a precursor via a powder-based foaming process. Through systematic modification of the polymer backbone and optimization of the foaming conditions, we successfully obtained low-density foams with uniform pore sizes on the order of several hundred micrometers. In particular, PIFs exhibited not only mechanical compliance but also outstanding thermal stability. This study highlights the need for thermally stable yet mechanically flexible foam, and the potential of soft PIFs to expand the scope of high-performance polymer applications.