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기능성 고분자(I)

  • Sep 30(Tue), 2025, 09:00 - 12:00
  • 포스터장
  • Chair : 박민주,박정태
09:00 - 10:30
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[1PS-242]

우수논문발표상 응모자

Enhancing thermal and dielectric performance of PI-PDMS composites using silane-grafted AlN and KNN fillers

발표자양시윤 (국립금오공과대학교)

연구책임자정현민 (국립금오공과대학교)

공동저자정현민 (국립금오공과대학교), 양시윤 (국립금오공과대학교), 박진홍 (국립금오공과대학교), 김지훈 (국립금오공과대학교), 박건교 (국립금오공과대학교), 민선경 (국립금오공과대학교 ), 김주헌 (중앙대학교), 김민수 (중앙대학교)

Abstract

Enhancing both thermal conductivity and dielectric properties of polymer composites is important for advanced electronic applications. In this study, a polyimide (PI)-polydimethylsiloxane (PDMS) matrix was reinforced with aluminum nitride (AlN) and potassium sodium niobate (KNN) fillers. Surface-treated AlN improved thermal conductivity up to 3.34 W/m·K, while KNN increased the dielectric constant to 300, though with slight thermal degradation. By optimizing the filler ratio, the PI-PDMS/(90AlN-GPTMS/10KNN) composite achieved 2.7 W/m·K in thermal conductivity and 30.1 in dielectric constant at 10 kHz. These results show that surface modification and filler composition control enable simultaneous improvement of thermal and dielectric performance. This work offers a practical strategy for developing PI-based composites with balanced properties suitable for electronic and thermal management applications.

Poster