The Polymer Society of Korea

Abstract

High-temperature adhesives are essential in advanced industries such as aerospace, automotive, and electronics, where extreme thermomechanical stability is required. However, conventional adhesives based on irreversible thermosets have critical limitations in recyclability and sustainability. Herein, we present a sustainable and reusable high-temperature polyimide adhesive utilizing dynamic covalent chemistry (DCC). The adhesive features a polyimide backbone end-capped with phenylboronic acid, which undergoes dehydrative cyclization to form reversible boroxine bonds. This dynamic network imparts high thermal stability and enables reversible bond exchange under external stimuli. The thermomechanical properties and reversibility of the adhesive were thoroughly characterized, and its adhesive performance was systematically evaluated. The results demonstrate the potential of dynamic covalent polyimide adhesives as next-generation sustainable solutions for high-performance applications.