Additive Manufacturing with Silicone, Polydicyclopentadiene, and Composites via Heating at a Patterned Photothermal Interfaces (HAPPI)
발표자
이창욱 (University of Wisconsin-Madison)
연구책임자
Andrew J. Boydston (University of Wisconsin-Madison)
초록
내용
We report a new technology, heating at a patterned photothermal interface (HAPPI), which achieves additive manufacturing (AM) of thermoset resins. In HAPPI AM, the patterned light dictates the pattern of heat on the bottom of the vat, which is translated into a thermally cured resin layer. We describe the HAPPI printing using a commercial Sylgard 184 polydimethylsiloxane resin. We further discuss commercialization of HAPPI technology with medical grade silicone to prosthetic and orthotic markets. Additionally, we report AM of polydicyclopentadiene (pDCPD) and pDCPD-carbon fiber composites using encapsulated Grubbs-type catalyst particles. Incorporating carbon fibers in the pDCPD matrices enhanced Young’s modulus and ultimate strength in HAPPI samples, with maximum observed increases of 220% and 170%, respectively. We envision HAPPI AM to enable pathways to create 3D composite structures of other thermosets, such as urethanes, thiol-ene networks, and thiol-epoxide materials.