The Polymer Society of Korea

이현준 (한양대학교)

엄영호 (한양대학교)

Polyimide (PI) films are known for excellent thermal stability, making them suitable for aerospace use under extreme temperatures. In such applications, long-term thermal and mechanical stability is essential. This study investigates high-temperature degradation of PI films to define their thermal performance limits for aerospace-grade applications. Heat treatment was performed above 300 °C, and changes in structure and properties were analyzed using FT-IR and SEM. Results showed notable mechanical strength loss as degradation progressed. Based on these findings, a safe operational temperature range was proposed to ensure material stability. These results can help evaluate the reliability of PI-based aerospace materials.