Curing Kinetics, Processability, and Thermal Behavior of End-Capped Imide-Based Thermosets with Different Backbone Conformations
발표자
남기호 (경북대학교)
연구책임자
남기호 (경북대학교)
초록
내용
Phenylethynyl-terminated imide (PETI) oligomers are high-performance thermosetting materials widely applied in films, adhesives, moldings, and composite matrices. Their tunable molecular weights and melt viscosities allow precise control of processing and end-use properties. Upon thermal curing, PETIs form ultra-rigid crosslinked networks, imparting exceptional thermal stability, solvent resistance, and mechanical performance. This presentation highlights recent advances in ultra-high-temperature PETI systems, emphasizing structure–property–processing relationships. It begins with a brief historical overview and key physicochemical attributes of PETIs, followed by a focused discussion on molecular design strategies employing noncoplanar monomers (e.g., kinked and cardo structures), fluorinated groups, flexible linkers, and liquid crystalline mesogens. The talk concludes with current challenges and prospective research directions for next-generation PETI-based materials.