Fluorinated Boron Nitride Nanosheet-Reinforced TLCP Composites with High Thermal Conductivity and Low Dielectric Constant for Advanced PCB Applications
발표자
이준협 (충남대학교)
연구책임자
정영규 (충남대학교 유기응용재료공학과)
초록
내용
As microelectronic devices evolve, PCB materials with both high thermal conductivity and low dielectric constant are increasingly needed. Conventional use of porous fillers to lower dielectric constant often compromises thermal conductivity. This study addresses the trade-off by using boron nitride nanosheets (BNNSs), known for high thermal conductivity. BNNSs were exfoliated via ultrasonication and ball milling, then fluorinated with CF4 plasma to form fluorinated BNNSs (F-BNNSs). F-BNNSs were incorporated into thermotropic liquid crystalline polyester (TLCP), a polymer with excellent mechanical strength, thermal stability, and low moisture absorption. The resulting F-BNNS/TLCP composites exhibited both enhanced thermal conductivity and low dielectric constant while retaining TLCP’s intrinsic properties. This approach effectively overcomes the traditional conflict between thermal and dielectric performance, offering strong potential for advanced electronic applications.