Enhancing Thermal Conductivity and Stability of Organic PCM Composites via Segregated Filler Network Formation
발표자
이동훈 (부산대학교)
연구책임자
김채빈 (부산대학교)
초록
내용
Phase change materials (PCMs) can absorb and release heat during phase transitions without a change in temperature, making them useful for thermal management. However, organic PCMs typically suffer from low thermal conductivity and leakage, limiting their practical use. In this work, we present a PCM composite incorporating a highly interconnected network of thermally conductive hexagonal boron nitride (h-BN) fillers to address these challenges. The composite is fabricated by blending h-BN with two immiscible organic PCMs in the molten state, forming a Pickering emulsion that solidifies upon cooling. This induces a 2D filler network that improves thermal conductivity (~20.2 W/m·K) and maintains structural stability above both PCMs' melting points. Compared to single-PCM composites, the material shows improved heat transfer and thermal stability. This strategy offers a promising pathway for advancing the performance and reliability of PCM-based thermal regulation systems.