Enhanced Interfacial Adhesion and Thermal Stability of Epoxy Composites Reinforced with Surface-reactive Silica Nanoparticles
발표자
황민영 (충남대학교 유기재료공학과)
연구책임자
정영규 (충남대학교 유기재료공학과)
초록
내용
Epoxy composites are commonly used as epoxy molding compounds (EMCs) to protect integrated circuits (ICs) from external environments. However, the significant mismatch in the coefficient of thermal expansion (CTE) between the epoxy matrix and fillers induces thermal stress, which degrades mechanical properties, causes warpage, and leads to interfacial cracking of ICs, limiting their industrial applicability. This study introduces a novel epoxy composite system that incorporates silica nanoparticles modified with 3-glycidyloxypropyltrimethoxysilane (GPTMS) as a silane coupling agent. The inclusion of GPTMS-modified silica enhances interfacial adhesion and effectively reduces thermal expansion. Consequently, the developed composites exhibit improved mechanical strength, enhanced thermal stability, and excellent compatibility with various functional fillers. This work presents a promising approach for the development of high-performance epoxy composites for next-generation applications.