For high-performance semiconductors and necessity of chip miniaturization, which has reached its physical limit in the front end process, the packaging has become important. Over the last decades, packaging technology was focusing on those functionalities. Recently, Packaging offers a higher performance as well as multifunctionality by stacking multiple chips. Among heterogeneous semiconductor integration technologies, hybrid bonding enable fine pitch by directly bonding the same substances. This study offers a simpler way of polymer/metal low-temperature bonding using de-wetting method, that does not require CMP processing by utilizing polymer fluidity and takes advantage of any desired polymer. As a result, we confirmed successful bonding by measuring the electrical properties as well as the bonding strength. Therefore, it is expected to facilitate commercialization of hybrid bonding by cost reduction and offering flexible polymer selection.