Fabrication of Flexible Thermal Interface Materials with Enhanced Anisotropic Thermal Conductivity through Dielectrophoresis
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The escalating demand for Thermal Interface Material (TIM) composites, characterized by enhanced elasticity and thermal conductivity, has been catalyzed by the exigency for economically viable solutions in thermal management. This trend has been driven by the rapid advent of flexible integrated electronic devices that generate notable thermal dissipation challenges. In this study, we applied the dielectrophoresis (DEP) process to obtain anisotropic alignment of metallic filler particles in a polymer matrix. This strategic alignment within the polymer matrix improved the anisotropic thermal conductivity of the composite, achieving values as high as 0.6 W/m*K, with a low filler volume ratio of ф = 20%. Moreover, the TIM specimen demonstrated good elasticity and flexibility through multiple mechanical property testing.