Fabrication and Piezoelectric Characterization of Boron Nitride Nanosheet-Reinforced Polyimide Nanocomposite Films
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Polyimide (PI) is a high-performance polymer, showcasing exceptional properties such as heat and chemical resistance, mechanical strength, and excellent electrical characteristics. We synthesized a PI precursor, poly(amic acid), containing flexible ether bonds through the polycondensation of 4,4'-diaminodiphenyl ether and 4,4'-oxydiphthalic anhydride. In this study, we incorporated boron nitride nanosheet (BNNS) as a filler due to its notable in-plane thermal conductivity and piezoelectricity. Employing a solution casting and imidization process, we successfully fabricated PI/BNNS nanocomposite films. Dielectric and piezoelectric properties were measured using an Impedance analyzer and a digital multimeter, respectively. PI/BNNS nanocomposite films are believed to have the potential for application in flexible energy harvesting devices or tactile sensors, offering advantageous heat-dissipating and insulating properties.