Preparation of low dielectric loss multi-layer polyimide films for FCCL applications
발표자
()
초록
내용
The flexible copper clad laminate (FCCL) consists of a laminated structure where the copper foil serves as a conductor, and the polyimide acts as a dielectric layer. However, typical polyimide has a dielectric constant of around 3.4, which is insufficient to ensure insulation in high-frequency regions. Therefore, fluorine-based polyimides are synthesized to achieve a lower dielectric constant, but these face issues with manufacturing FCCL due to their poor adhesion to copper. In this study, we formulated a dielectric layer material for FCCL by laminating copper-adherent polyimide with low-dielectric-constant fluorine-based polyimide. Direct lamination of these two layers is problematic due to their dissimilar chemical properties, resulting in ineffective adhesion. To overcome this obstacle, we synthesized a poly(amic acid) block copolymer, which was employed as an adhesive layer, offering a promising solution to this adhesion problem.