Structures and Properties of POSS-Reinforced TLCP Nanocomposites Fabricated by Masterbatch Melt-Compounding
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초록
내용
The emergence of 5G and 6G mobile communication technologies has generated a surge in demand for ultra-high frequency printed circuit boards (PCBs) to support high-speed electronic equipment. In response, Thermotropic liquid crystalline polyesters (TLCPs) have garnered considerable attention as a promising substrate material for these high-speed communication PCBs. The appeal of TLCPs lies in their low dielectric property, high thermal stability, and minimal moisture content. This study aims to explore the potential of enhancing TLCPs by incorporating polyhedral oligomeric silsesquioxane (POSS), a low-dielectric organo-inorganic hybrid nanoparticle, as an additive. To achieve this, we employed an effective masterbatch melt-compounding technique to produce TLCP/POSS nanocomposites. Our study encompasses a comprehensive characterization of the fabricated nanocomposites, focusing on their structural, thermal, mechanical, rheological, and dielectric properties.