Copper Nanowires/Sendust/Polystyrene nanocomposite for electromagnetic shielding
발표자
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초록
내용
Nano-filled polymer composites have emerged as one of the most promising material combinations for mid-level electromagnetic shielding. We used an extruded copper nanowires/polystyrene/sendust composite to verify the results of electromagnetic shielding. Copper nanowires were synthesized using the polyol method, resulting in an average diameter of 40–60 nm and lengths up to several millimeters. After pressing, the sample diameter was 0.4 mm and the results were checked for electromagnetic shielding efficiency (SE) and reflection loss (RL). The best result was achieved with a 5/15/80% copper nanowires/sendust/polystyrene composite percentage, exhibiting an EMI SE of 38.1 dB and reflection loss peaks at 3.78 and 14.2 GHz. Considering the materials and production technology's cost-effectiveness, these results are highly encouraging.