Enhanced thermal conductivity of polymer composites incorporating h-BN and BNNT hybrid
발표자
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초록
내용
With the miniaturization and integration of electronic devices, interest in thermal interface materials that can minimize electrical interference between adjacent devices along with effective heat dissipation is increasing. Based on these demands, boron nitride (BN) exhibiting high thermal conductivity and low electrical conductivity is suitable as a filler for improving heat dissipation and electrical insulation properties of polymer composites. In this study, an epoxy-based polymer composite incorporating hexagonal-BN and BN nanotube simultaneously was fabricated. In addition, synergistic enhancement of thermal conductivity of the composite was investigated experimentally and theoretically based on the nano-bridge effect between 1D and 2D fillers.